How do Warpage and Deformation occur during Solvent Debinding? How can this be resolved?

Date：2025-07-29   Views：0

(Background: To remove as much binder as possible from the green body, degreasing requires an extremely slow heating rate and a long degreasing time, divided into 2 to 3 stages, with each stage removing a different component of the binder.)

Mechanism:

During solvent debinding, the solvent is typically heated to increase the reaction rate and improve debinding efficiency. However, heating can soften binders such as wax, and improper handling may cause part warpage or deformation, especially when parts have complex structures like cantilever designs.

Causes:

• Residual stress generated during molding

• Lack of support for special structures (e.g., cantilevers)

• Trapped air

Solutions:

• Improve the type of binder and the composition ratio with metal powder

• Decrease the temperature during solvent debinding, controlling it between 50–90°C

• Modify the part shape to better support thin or extended sections

• Use fixtures during debinding

• Increase cool time and better cooling in tool